Ceramic Substrate

 

Ceramic substrate materials are widely used in power electronics, electronic packaging, hybrid microelectronics and multi-chip modules. This is due to their excellent thermal conductivity and air tightness, which makes them ideal for various applications.

 

The main category of ceramic substrate materials are:
1、Al2O3
Alumina ceramic substrates are the most commonly used substrate materials in the electronics industry. This is because of their ceramic substrate’s high strength and chemical stability, compared to most other oxide ceramics in terms of mechanical, thermal, and electrical properties.

These substrates are popular due to the abundant source of raw materials, suitable for a wide variety of technical manufacturing and different shapes.

2、BeO
It has a higher thermal conductivity than metal aluminum. It is used in occasions where high thermal conductivity is required. However, the temperature exceeds 300 °C and decreases rapidly. The most important thing is that its toxicity limits its own development, which is a challenge for ceramic substrates.

3、AlN
AlN has two very important properties worth noting. One is high thermal conductivity, and the other is the coefficient of expansion that matches Si. The disadvantage is that even a very thin oxide layer on the surface will have an impact on thermal conductivity. Only strict control of materials and processes can produce AlN ceramic substrates with good consistency.

At present, large-scale AlN production technology is still immature in China. Additionally, the price of AlN compared to other ceramic substrates is relatively high compared to Al2O3. This is also a bottleneck restricting its development. Based on the above reasons, it can be known that alumina ceramics are still in a dominant position in the fields of microelectronics, power electronics, hybrid microelectronics, and power modules. They are favored due to their superior comprehensive performance.