Aluminium Nitride Ceramic Plate

 

Aluminium nitride ceramic plate with its excellent ability to dissipate heat up to 200 W/mK.

Chemical formula:

The chemical composition is AI 65.81%, N 34.19%. Its powder is white or gray-white, and its single crystal is colorless and transparent. The sublimation decomposition temperature under normal pressure is 2450 °C.   

Characteristics of Aluminium Nitride Ceramic Plate:

It has high thermal conductivity (> 170W/m·K), close to BeO and SiC, and it’s more than 5 times that of Al2O3. The coefficient of thermal expansion (4.5×10-6 °C) matches with Si (3.5~4×10-6 °C) and GaAs (6×10-6 °C). 

It also has excellent electrical properties such as dielectric constant, dielectric loss, bulk resistivity, and dielectric strength. Moreover, its good mechanical properties show flexural strength higher than Al2O3 and BeO ceramics. The material can be sintered under atmospheric pressure. 

Advantages of Aluminium Nitride Ceramics:

It boasts high thermal conductivity, low expansion coefficient, and high strength. Additionally, it has high temperature resistance, chemical corrosion resistance, and high resistivity. With low dielectric loss, it is an ideal large-scale integrated circuit heat dissipation substrate and packaging material.