Aluminum Nitride Ceramic Substrate And Alumina Ceramic Substrate
Regarding ceramic substrates, they can generally divide into two categories: Aluminum Nitride Ceramic Substrate And Alumina Ceramic Substrate.
So what are the differences between aluminum nitride ceramic substrate and alumina ceramic substrate? The differences between these ceramic substrates are noteworthy.
First, introduce the AL2O3 substrate
- Al2O3 ceramic is a ceramic material with alumina (Al2O3) as the main body. It uses for thick film integrated circuits, high temperature resistance, corrosion resistance, wear resistance, and high mechanical properties. Speaking of alumina ceramic substrates, these properties are exemplary.
- Al2O3 ceramics have good conductivity, mechanical strength and high temperature resistance.
- Al2O3 ceramics is one of the more widely used ceramic materials because of its superior performance. Its application in modern society has become more and more extensive, meeting the needs of daily use and special properties. Besides their versatility, Alumina Ceramic Substrate And Aluminum Nitride Ceramic Substrate complement applications.
Second, introduce the aluminum nitride ceramic substrate:
1. Aluminum nitride ceramic consists mainly of aluminum nitride (AIN) as the crystal phase of ceramics. It has high hardness, making processing very difficult. We usually process this special ceramic material with ceramic CNC machine tools. These tools use diamond grinding tools for processing.
2. AIN crystal consists of an [AIN4] tetrahedron as the structural unit. It is a covalent bonding compound with a fibrin-zinc type structure and belongs to the hexagonal crystal system.
3. Chemical composition consists of AI 65.81%, N 34.19%, with a specific gravity of 3.261g/cm³. The material is white or gray-white, and the single crystal is colorless and transparent. Its sublimation decomposition temperature under normal pressure is 2450. These chemical attributes underscore the efficacy of both aluminum nitride ceramic substrates and alumina ceramic substrates.
4. It is a high-temperature heat-resistant material. Coefficient of thermal expansion (4.0-6.0) X10(-6).
5. The thermal conductivity of polycrystalline AIN is 260W/(m.k). AIN ceramics are 5-8 times higher than alumina, giving them good thermal shock resistance. They can withstand extreme heat of 2200.
6. In addition, aluminum nitride has characteristics that prevent erosion by molten aluminum and other molten metals. Particularly, it has excellent erosion resistance to molten aluminum liquid. Thus, the use of Aluminum Nitride Ceramic Substrate distinguishes itself in metallurgy.